Integrated circuit package and integrated circuit module

ABSTRACT

An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.

PRIORITY STATEMENT

This application is a Divisional of U.S. application Ser. No.11/371,886, filed Mar. 10, 2006 now abandoned which claims the benefitof Korean Patent Application No. 10-2005-0052009, filed on Jun. 16,2005, in the Korean Intellectual Property Office, the disclosure each ofwhich is incorporated herein in its entirety by reference.

BACKGROUND

1. Field of the Invention

Example embodiments of the present invention relate to an integratedcircuit package and an integrated circuit module, and more particularlyto an integrated circuit package and an integrated circuit module thatmay provide reliable electrical connections during a stacking process.

2. Description of the Related Art

An integrated circuit chip may have a significant number of datainput/output pads. Accordingly, an integrated circuit package (that mayimplement the integrated circuit chip) may have a significant number ofpins. A ball grid array (BGA) packaging technology may be pursued as amethod of forming external connection terminals in an integrated circuitpackage. The BGA packaging technology may implement solder balls insteadof pins for electrical connection with an external device.

FIG. 1 is a cross-sectional view of a conventional BGA package that maybe stacked on a printed circuit board.

Referring to FIG. 1, the BGA package 101 may include a board 111. Anintegrated circuit chip 121 may be mounted on the board 111. A moldingresin 131 may seal the integrated circuit chip 121. Solder balls 141 maybe provided on the board 111. The printed circuit board 105 may includea plurality of solder lands 151.

An infrared reflow process may be implemented to bond the solder balls141 to corresponding solder lands 151 to electrically connect togetherthe BGA package 101 and the printed circuit board 105.

FIG. 2 is a cross-sectional view of another BGA package that may bestacked on the BGA package shown in FIG. 1.

Referring to FIG. 2, the stacked BGA package 201 may include anintegrated circuit chip 221 mounted on a board 211. The integratedcircuit chip 221 may be molded with a molding resin 231. The BGA package101 and the stacked BGA package 201 may be electrically connectedtogether by solder balls 241. An infrared reflow process may beimplemented to bond the solder balls 241 to desired package components.

Although the conventional packages are generally thought to beacceptable, they are not without shortcomings.

For example, a solder joint may be weakened by thermal mismatch betweenthe solder balls 141 and the solder lands 151. Accordingly, the solderballs 141 may become disjoined from the solder lands 151.

Also, a solder joint may be weakened by warpage of the BGA packages 101and 201. Accordingly, the solder balls 141 may become disjoined from thesolder lands 151.

Furthermore, a solder material may creep from a solder joint area duringa thermal cycle process because a melting point of a solder is low.Accordingly, the solder joint may become disjoined.

Moreover, a solder joint area may crack when the BGA packages and/or theprinted circuit board receives external mechanic impact because a soldermay be formed of a fragile intermetallic compound. Such a crack maycause disjoining of the solder joint.

Finally, a temperature environment may be higher than 230° C. when theBGA package 201 is stacked on the BGA package 101, and/or when the BGApackage 101 is stacked on the printed circuit board 105. The integratedcircuit chips 121, 221 may be damaged by such a temperature environment.The above noted shortcomings may become more prevalent as the number ofinfrared reflow processes increases.

SUMMARY

According to an example, non-limiting embodiment, a package may includea board that may support an integrated circuit chip. A post pin may beprovided on a surface of the board. The post pin may be electricallyconnected to the integrated circuit chip. A land pin may be provided onanother surface of the board. The land pin may be electrically connectedto the integrated chip.

According to another example, non-limiting embodiment, a module mayinclude a first package that may have a first board. A land pin may beprovided on the first board. A first integrated circuit chip may bemounted on the first board. The land pin may project from the firstboard. The land pin may be electrically connected to the firstintegrated circuit chip. A second package may include a second board, apost pin, and a second integrated circuit chip may be mounted on thesecond board. The post pin may project from the second board. The postpin may be electrically connected to the second integrated circuit chip.The second package may be stacked on the first package, such that thepost pin may be joined to the land pin.

According to another example, non-limiting embodiment, a module mayinclude a stack of packages. Each package may include a board that maysupport an integrated circuit chip. A post pin may be provided on afirst surface of the board. The post pin may be electrically connectedto the integrated circuit chip. A land pin may be provided on a secondsurface of the board. The land pin may be electrically connected to theintegrated circuit chip. The post pin of one package may be joined tothe land pin of an adjacent package.

According to another example, non-limiting embodiment, a module mayinclude a printed circuit board. The printed circuit board may include acircuit board having electric circuits. A land pin may be provided on asurface of the circuit board. The land pin may have a concavity. Theland pin may be electrically connected to the electric circuits. Anintegrated circuit package may be stacked on the printed circuit board.

According to another example, non-limiting embodiment, a package mayinclude a substrate. An integrated circuit chip may be provided on thesubstrate. A pair of conductive supports may be provided on oppositesides of the substrate. The pair of conductive supports may beelectrically connected to the integrated circuit chip.

BRIEF DESCRIPTION OF THE DRAWINGS

Example, non-limiting embodiments of the present invention will bedescribed with reference to the attached drawings in which:

FIG. 1 is a cross-sectional view of a conventional BGA package stackedon a printed circuit board;

FIG. 2 is a cross-sectional view of another conventional BGA packagestacked on the BGA package shown in FIG. 1;

FIG. 3 is a cross-sectional view of an integrated circuit packageaccording an example embodiment of the present invention;

FIG. 4 is a cross-sectional view of a portion “A” shown in FIG. 3;

FIG. 5 is a cross-sectional view of a method that may be implemented forstacking two integrated circuit packages;

FIG. 6 is a cross-sectional view of an integrated circuit moduleincluding two stacked integrated circuit packages shown in FIG. 3;

FIG. 7 is a cross-sectional view of an integrated circuit packageaccording another example embodiment of the present invention;

FIG. 8 is a cross-sectional view of an integrated circuit moduleconfigured with two stacked integrated circuit packages shown in FIG. 7;

FIG. 9A is a perspective view of another example embodiment of the holeof the land pin shown in FIG. 7;

FIG. 9B is a plan view of the hole shown in FIG. 9A;

FIG. 10 is a cross-sectional view of the post pin of the stackedintegrated circuit package shown in FIG. 8 provisionally joined to theland pin shown in FIG. 9;

FIG. 11 is a cross-sectional view of the post pin completely joined tothe land pin;

FIG. 12A is a plan view of another example embodiment of the post pinshown in FIG. 7;

FIG. 12B is a side view of the post pin shown in FIG. 12A;

FIG. 13 is a cross-sectional view of another example embodiment of theland pin shown in FIG. 7;

FIG. 14 is a cross-sectional view of the post pin of FIG. 8 joined tothe land pin of FIG. 13;

FIG. 15 is a cross-sectional view of another example embodiment of thepost pin shown in FIG. 7;

FIG. 16 is a cross-sectional view of the post pin of FIG. 15 joined tothe land pin of FIG. 13;

FIG. 17 is a cross-sectional view of another example embodiment of thepost pin shown FIG. 7;

FIG. 18 is a cross-sectional view of the post pin of FIG. 17 joined tothe land pin of FIG. 13; and

FIG. 19 is a cross-sectional view of an integrated circuit moduleaccording to an example embodiment of the present invention.

The drawings are provided for illustrative purposes only and are notdrawn to scale. The spatial relationships and relative sizing of theelements illustrated in the various embodiments may be reduced, expandedand/or rearranged to improve the clarity of the figure with respect tothe corresponding description. The figures, therefore, should not beinterpreted as accurately reflecting the relative sizing or positioningof the corresponding structural elements that could be encompassed by anactual device manufactured according to example embodiments of theinvention.

DETAILED DESCRIPTION OF EXAMPLE, NON-LIMITING EMBODIMENTS

Example, non-limiting embodiments of the present invention will bedescribed with reference to the accompanying drawings. This inventionmay, however, be embodied in many different forms and should not beconstrued as limited to example embodiments set forth herein. Rather,the disclosed embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art. The principles and features of thisinvention may be employed in varied and numerous embodiments withoutdeparting from the scope of the invention.

Well-known structures and processes are not described or illustrated indetail to avoid obscuring the present invention.

An element is considered as being mounted (or provided) “on” anotherelement when mounted or provided) either directly on the referencedelement or mounted (or provided) on other elements overlaying thereferenced element. Throughout this disclosure, spatial terms such as“upper,” “lower,” “above” and “below” (for example) are used forconvenience in describing various elements or portions or regions of theelements as shown in the figures. These terms do not, however, requirethat the structure be maintained in any particular orientation.

FIG. 3 is a cross-sectional view of an integrated circuit packageaccording to an example embodiment of the present invention.

Referring to FIG. 3, the integrated circuit package 301 may include aboard 311, an integrated circuit chip 321, a molding resin 331, aplurality of first conductive supports 341 and a plurality of secondconductive supports 351. In the example embodiments, the firstconductive supports 341 may be referred to as “post pins” 341, and thesecond conductive supports 351 may be referred to as “land pins” 351.However, the first and the second conductive supports 341 and 351,respectively, are not limited to any particular shape, as will becomemore apparent by the description of the example, non-limitingembodiments that follows.

The integrate circuit chip 321 may be mounted on the board 311. Theintegrated circuit chip 321 may be electrically connected to conductivelines 313 by bonding wires 323, for example. The conductive lines 313may be metal lines, for example. The integrated circuit chip 321 and theboding wires 323 may be sealed by the molding resin 331. The moldingresin 331 may (for example) protect the integrated chip 321 and thebonding wires 323 from the external environment.

The metal lines 313 may extend along the surface of (or within) theboard 311. The metal lines 313 may be electrically connected to the postpins 341. Accordingly, the post pins 341 may be electrically connectedto the integrated circuit chip 321 through the metal lines 313 and thebonding wires 323.

The post pins 341 may project from the lower surface of the board 311.In this example embodiment, the post pins 341 may have an elongatedshape. In alternative embodiments, the post pins 341 may have numerousand alternative shapes. By way of example only, four post pins 341having a square cross-sectional shape may be provided. However, more orless than four post pins 341 may be suitably implemented, and the postpins 341 may have any geometric cross-section shape. In this exampleembodiment, the post pins 341 may have a uniform thickness. Inalternative embodiments, the thickness of the post pin 341 may varyalong the vertical length of the post pin 341. The post pins 341 mayproject further from the board 311 than the land pins 351. By way ofexample only, the post pins 341 may have heights from 50 to 200 μm,while the land pins 351 may have heights from 0 to 30 μm. In thisexample embodiment, the post pins 341 may be provided on the same sideof the board 311 as the integrated circuit chip 321. In alternativeembodiments, the post pins 341 and the integrated circuit chip 321 maybe provided on opposite sides of the board 311. By way of example only,the post pins 341 may be fabricated from metal.

The land pins 351 may be arranged at locations on the board 311 thatcorrespond to the locations of the post pins 341. The land pins 351 andthe post pins 341 may be provided on opposite sides of the board 311.Land pins 351 of numerous and varied shapes may be suitably implemented.Via holes 361 may be provided between the land pins 351 and the postpins 341. The via holes 361 may be filled with a conductive material,such as metal, for example. The land pins 351 and the post pins 341 maybe electrically connected together through the metal in the via holes361. By way of example only, the land pins 351 may be fabricated frommetal.

FIG. 4 is a cross-sectional view of the portion “A” shown in FIG. 3.

Referring to FIG. 4, the post pin 341 and the land pin 351 may be coatedwith conductive materials 411, 412. The conductive materials 411, 412may include (for example) nickel, gold, and/or copper. Consider thefollowing illustrative examples. The post pin 341 and the land pin 351may be fabricated from copper and coated with a compound metal of goldand nickel. The post pin 341 and the land pin 351 may be fabricated fromcopper and coated with nickel and then coated with gold. Here, thethickness of the gold coating layer may be less than the thickness ofthe nickel coating layer. The post pin 341 and the land pin 351 may befabricated from copper and coated with gold and then coated with copper.The post pin 341 and the land pin 351 may be fabricated from copper andcoated with nickel and then coated with copper.

Corners 431, 432 of base portions of the post pin 341 and the land pin351 may be coated with resin, such as photo solder resist (PSR), forexample. The PSR 421, 422 may (for example) protect the corners 431, 432from being broken and/or cracked.

FIG. 5 is a cross-sectional view of a method that may be implemented forstacking two integrated circuit packages.

Referring to FIG. 5, a second integrated circuit package 302 may bearranged below a first integrated circuit package 301. Elements 311,331, 341, 351 of the first integrated circuit package 301 havestructures identical to elements 312, 332, 342, 352 the secondintegrated circuit package 302.

Blocks 511, 512 may be implemented to stack the first and the secondintegrated circuit package 301 and 302. The blocks 511, 512 may beheated to temperatures from 200 to 300° C. Once heated, the blocks 511,512 may press the first and the second integrated circuit packages 301and 302 together. The block 511 may confront the land pins 351 of thefirst integrated circuit package 301, and other block 512 may confrontthe post pins 342 of the second integrated circuit package 302. Theheated blocks 511 and 512 may press the first and the second integratedcircuit packages 301 and 302 to join together the post pins 341 of thefirst integrated circuit package 301 and the land pins 352 of the secondintegrated circuit package 302.

Because the heated blocks 511 and 512 may be implemented to stack thefirst and the second integrated circuit packages 301 and 302, aconventional reflow process (e.g., an infrared reflow process) may notbe required. As described above, the infrared reflow process may beperformed for the solder joint of the solder balls 141 and solder lands151 of the BGA package as shown in FIG. 1 according to the conventionalart.

As shown in FIG. 5, heat sinks 521, 522 may be mounted on the moldingresins 331 and 332.

The heat sinks 521 and 522 may absorb heat applied while stacking theintegrated circuit packages 301 and 302 using the heated blocks 511 and522. In this way, the heat sinks 521 and 522 may protect the integratedcircuit chip 321 of FIG. 3 from heat.

In the example embodiment, the heat sinks 521 and 522 may be mounted onthe same side of the board as the molding resins 331 and 332. Inalternative embodiments, the heat sinks and the molding resins may bemounted on opposite sides of the boards, respectively.

FIG. 6 is a cross-sectional view of an integrated circuit moduleincluding a stacked of two integrated circuit packages. The twointegrated circuit packages 301 and 302 may have the same structure asthe integrated circuit package 301 shown in FIG. 3.

Referring to FIG. 6, the post pins 341 of the first integrated circuitpackage 301 may be joined to the land pins 352 of the second integratedcircuit package 302.

In the example embodiment, the integrated circuit module includes twointegrated circuit packages. In alternative embodiments, an integratedcircuit module may include a stack of more than two integrated circuitpackages.

After joining together the post pins 341 and the land pins 352, thejoint areas may be coated with a ductile plating material and/or abonding material. Therefore, the joint areas of the post pins 341 andthe land pins 352 may be protected from external impacts, and the jointcondition of the joint areas may be maintained.

As shown in FIGS. 3 through 6, the post pins 341, 342 and the land pins351 and 352, which may be fabricated from metal, may be provided on theboards 311, 312. The post pins 341, 342 and the land pins 351, 352 maybe joined together by mechanical force. In this way, the infrared reflowprocess may not be required. Furthermore, the electrical connectionstate between the post pins and the land pins may be maintained becausethe joint state of the post pins 341 and the land pins 351 may not beinfluenced by external temperature, thermal variation, warpage of theintegrated circuit packages 301, 302 and/or external mechanical impact.

FIG. 7 is a cross-sectional view of an integrated circuit packageaccording another example embodiment of the present invention.

Referring to FIG. 7, the integrated circuit package 701 may include anintegrated circuit chip 721, a molding resin 731, a plurality of postpins 741 and a plurality of land pins 751.

The board 711, metal lines 713, integrated circuit chip 721, bondingwires 723 and molding resin 731 may be structurally and functionallyidentical to the metal lines 313, the integrated circuit chip 321, thebonding wires 323 and the molding resin 331 shown in FIG. 3, andtherefore a detailed description of the same is omitted.

The post pins 741 may project from a surface of the board 711. In thisexample embodiment, the post pins 741 may have an elongated shape andhave a circular cross-sectional shape. The post pins 741 may be providedon any surfaces of the board. The post pins 741 may be fabricated frommetal.

The land pins 751 may be provided with holes 753. By way of exampleonly, the holes 753 may be provided at a center of the land pins 751.The land pins 751 may be arranged at locations on the board 711 thatcorrespond to location of the post pins 741. The land pins 751 and thepost pins 741 may be provided on opposite sides of the board 711. Viaholes 761 may be provided between the land pins 751 and the post pins741. The via holes 761 may be filled with a conductive material, such asmetal, for example. The land pins 751 and the post pins 741 may beelectrically connected together through the metal in the via holes 761.The land pins 751 may be fabricated from metal.

The post pins 741 and the land pins 751 may be coated with conductivematerial. For example, the post pins 741 and the land pins 751 may befabricated from copper and coated with compound metal of gold andnickel. The post pins 741 and the land pins 751 may be fabricated fromcopper and coated with nickel and then coated with gold. The post pins741 and the land pins 751 may be fabricated from copper and coated withgold and then coated with copper. The post pins 741 and the land pins751 may be fabricated from copper and coated with nickel and then coatedwith copper.

Corners 745 of base portions of the post pins 741 and the land pins 751may be coated with PSR. The PSR may, for example, serve to protect thecorners 745 from being cracked and/or broken.

Each post pin 741 may have a bottom surface having a diameter r1 shorterthan a diameter r2 of the base portion of the post pin 741. Each landpin 751 may have a hole 753 with a diameter r3 that may be longer thanthe diameter r1 of the bottom surface of the post pin 741 and shorterthan the diameter r2 of the base portion of the post pin 741. Therefore,the post pins of a second integrated circuit package 702 of FIG. 8 maybe inserted to the holes 753 of the land pins 751.

FIG. 8 is a cross-sectional view of an integrated circuit module thatmay include two stacked integrated circuit packages shown in FIG. 7.

Referring to FIG. 8, the post pins 742 of the second integrated circuitpackage 702 may be joined to the land pins 751 of the first integratedcircuit package 701. The post pins 742 and the land pins 752 of thesecond integrated circuit package 702 may be structurally identical tothe post pins 741 and the land pins 751 of the first integrated circuitpackage 701.

In the example embodiment, the integrated circuit module may include twointegrated circuit packages 701 and 702. In alternative embodiments, anintegrated circuit module may be manufactured by stacking more than twointegrated circuit packages 701 and 702.

The blocks 511 and 512 of FIG. 5 may be employed to stack the integratedcircuit packages 701 and 702. The post pins 742 and the land pins 751may be joined together by pressing the integrated circuit packages 701and 702 using the blocks 511 and 512. Here, the blocks 511 and 512 maynot be heated.

As described above, the blocks 511, 512 may be used to stack theintegrated circuit packages 701 and 702. Therefore, the joining processof the present embodiment may not require a reflow process (e.g., theinfrared reflow process that may be performed for the solder jointbetween the solder balls 141 and the solder lands 151 of theconventional BGA package as shown in FIG. 1). As a result, a costassociated with stacking the integrated circuit packages 701 and 702 maybe reduced.

After joining the post pins 742 and the land pins 751 a, the joint areamay coated with a ductile plating material and/or a bonding material,for example. The coating may protect the joint area of the post pins 742and the land pins 751 a to maintain a desired joint state.

FIG. 9A is a perspective view of another example embodiment of the holethat may be provided in the land pin shown in FIG. 7, and FIG. 9B is aplan view of the hole shown in FIG. 9A.

Referring to FIGS. 9A and 9B, the hole 753 a may include a main hole 754a having a relatively large diameter and a sub hole 755 a having adiameter smaller than the main hole 754 a.

When the second integrated circuit package 702 of FIG. 8 is stacked onthe first integrated circuit package 701 of FIG. 8, the post pin 742 ofthe second integrated circuit package 702 may be inserted into the mainhole 754 a. Air pushed by the post pin 742 may be exhausted through thesub-hole 755 a when the post pin 742 enters into the main hole 754 a.

The sub hole 755 a may protect the joint state from weakening,deteriorating and/or failure that may otherwise occur if air were toremain in the joint between the post pin 742 and the land pin.

FIG. 10 shows the post pin 742 of the stacked integrated circuit package702 of FIG. 8 provisionally connected to the hole 753 a of the land pin751 a.

As shown in FIG. 10, electrical characteristics of the integratedcircuit packages 701 and 702 of FIG. 8 may be measured uponprovisionally joining the post pin 742 to the hole 754 a of the land pin751 a. If the measured electric characteristics are not correct, thenthe post pin 742 may be disjoined from the land pin 751 a and correctiveaction may be taken. If the measured electric characteristics arecorrect, the post pin 742 may be completely joined to the land pin 751 aas shown in FIG. 11.

As described above, the electric characteristics of the integratedcircuit packages may be analyzed before firmly joining the post pin 742and the land pin 751 a. Accordingly, a defective processing cost and/ora test cost may be reduced, for example.

FIG. 12A shows another example embodiment of the post pin 742 of FIG. 8,and FIG. 12B is a side view of the post pin shown in FIG. 12A.

Referring to FIGS. 12A and 12B, the post pin 742 a may include grooveson a side surface. For example, the post pin 742 a may have an arcuatepost shape having four furrows 1211 and four ridges 1221. A diameter r13formed by the furrows 1211 may be shorter than a diameter r12 formed bythe ridges 1221.

Also, the diameter r3 of the hole 753 of the land pin 751 of FIG. 7 maybe longer than the diameter r11 of the bottom surface of the post pin742 a and shorter than the diameter r 12 of the base portion of the postpin 742 a. Accordingly, the post pin 742 a may be easily inserted into ahole of the land pin 751

The furrows 1211 and the ridges 1221 may improve the bonding forcebetween the post pin 742 a and the land pin 751 of FIG. 8 because theridges 1221 may be pushed into the furrows 1211 when the post pin 742 ais joined to the land pin 751.

FIG. 13 is a cross-sectional view of another example embodiment of theland pin 751 b. Referring to FIG. 13, a hole 753 b may be provided inthe land pin 751. The hole 753 b may have a bottom width w1 that may benarrower than the upper width w2. The bottom width w1 of the hole 753 bmay be about the same as or slightly wider than the diameter r1 of thebottom surface of the post pin 742. Accordingly, the post pin 742 ofFIG. 8 may be easily inserted to the land pin 751 b.

FIG. 14 is a cross-sectional view of the post pin 742 of FIG. 8 joinedto the land pin 751 b of FIG. 13. Referring to FIG. 14, the post pin 742may be inserted into the hole of the land pin 751 b. Solder 1401 may beapplied to the post pin 742 and the land pin 751 b. The solder mayimprove the boding force of the post pin 742 and the land pin 751 b.

FIG. 15 is a cross-sectional view of another example embodiment of thepost pin 741 b. Referring to FIG. 15, protrusions 1501 may be providedon a side surface of the post pin 741 b.

FIG. 16 is a cross-sectional view of the post pin 741 b of FIG. 15joined to the land pin 751 b of FIG. 13. Referring to FIG. 16, solder1601 may be applied to the post pin 741 b and the land pin 751 b. Thesolder 1601 may enhance the bonding force between the post pin 741 b andthe land pin 751 b.

FIG. 17 is a cross-sectional view of another example embodiment of thepost pin 741 c. Referring to FIG. 17, the post pin 741 c may have twostratums 1701 and 1702. In this example embodiment, each of the stratums1701 and 1702 may have a circular post shape. The length of the post pin741 c may the same as the post pin 741 of FIG. 7.

FIG. 18 is a cross-sectional view of the post pin 741 c of FIG. 17joined to the land pin 751 b of FIG. 13. Referring to FIG. 18, solder1801 may be applied to the post pin 741 c and the land pin 751 b. Thebonding force between the post pin 741 c and the land pin 751 b may beenhanced by forming the post pin 741 c as plural stratums. Of course,more than two stratums may be suitably implemented.

FIG. 19 is a cross-sectional view of an integrated circuit moduleaccording to an example embodiment of the present invention. Referringto FIG. 19, the integrated circuit module 1901 may include an integratedcircuit package 1911 and a printed circuit board (PCB) 1921. Theintegrated circuit package 1911 may have a structure identical to theintegrated circuit package 701 of FIG. 7. Therefore, the detaileddescription thereof is omitted.

The PCB 1921 may include circuit wires 1923 and land pins 1925. The landpins 1925 may be identical to the land pins 751 shown in FIG. 7.

As shown in FIG. 19, the integrated circuit module 1901 may bemanufactured by providing the land pins 1925 on the PCB 1921 andstacking the integrated circuit package 1911 on the PCB 1921.

As described above, the post pins 341, 342, 741, 742 and the land pins351,352, 751, 752 may be metallically joined and/or mechanically joinedtogether when the integrated circuit packages 301, 302, 701, 702, 1911are stacked and/or when the integrated circuit packages 301, 302, 701,702, 1911 are stacked on the PCB 1921.

The present invention has been shown and described with reference toexample, non-limiting embodiments thereof. It will be understood bythose of ordinary skill in the art that various changes in form anddetails may be made to the disclosed embodiments without departing fromthe spirit and scope of the present invention as defined by thefollowing claims.

1. A module, comprising: a printed circuit board; and an integratedcircuit package stacked on the printed circuit board; wherein theprinted circuit board includes: electric circuits; at least one land pinprovided on a first surface of the printed circuit board; and at leastone post pin fixed on a second surface of the printed circuit board;wherein the at least one land pin is electrically connected to theelectric circuits, wherein the at least one post pin is electricallyconnected to the electric circuits, wherein the at least one land pinhas a hole, wherein the hole has a first width, wherein the at least onepost pin includes: a bottom surface; and a base portion; wherein thebottom surface has a second width, wherein the base portion has a thirdwidth, wherein the second width is less than the first width, andwherein the third width is greater than the first width.
 2. The moduleof claim 1, wherein the integrated circuit package includes: a boardhaving an integrated circuit chip.
 3. The module of claim 1, wherein theprinted circuit board includes: a plurality of land pins provided on thefirst surface of the printed circuit board; and a plurality of post pinsfixed on the second surface of the printed circuit board.
 4. The moduleof claim 3, wherein a number of the land pins is equal to a number ofthe post pins.
 5. The module of claim 1, wherein the hole of the atleast one land pin includes: a main hole, and a sub hole connected tothe main hole.
 6. The module of claim 1, wherein the at least one postpin has at least one groove provided on a side surface of the at leastone post pin in a longitudinal direction.
 7. The module of claim 1,wherein the first surface is on an opposite side of the printed circuitboard from the second surface.
 8. The module of claim 1, wherein the atleast one post pin has a circular cross-sectional shape.
 9. The moduleof claim 1, wherein the at least one post pin has a circularcross-sectional shape having at least one furrow provided on a sidesurface of the at least one post pin.
 10. The module of claim 1, whereinthe at least one post pin is a single structure.
 11. The module of claim1, wherein the hole of the at least one land pin is circular.
 12. Apackage, comprising: a board supporting an integrated circuit chip; atleast one post pin fixed on a surface of the board; and at least oneland pin provided on another surface of the board; wherein the at leastone post pin is electrically connected to the integrated circuit chip,wherein the at least one land pin is electrically connected to theintegrated circuit chip, wherein the at least one land pin has a hole,wherein the hole has a first width, wherein the at least one post pinincludes: a bottom surface; and a base portion; wherein the bottomsurface has a second width, wherein the base portion has a third width,wherein the second width is less than the first width, and wherein thethird width is greater than the first width.
 13. The package of claim12, wherein the hole of the at least one land pin includes: a main holeand a sub hole connected to the main hole.
 14. The package of claim 12,wherein the at least one post pin has a circular cross-sectional shape.15. The package of claim 12, wherein the hole of the at least one landpin is circular.
 16. The package of claim 12, wherein the at least onepost pin has a circular cross-sectional shape having at least one furrowprovided on a side surface of the at least one post pin.
 17. The packageof claim 12, wherein the surface of the board is on an opposite side ofthe board from the another surface of the board.
 18. The package ofclaim 12, wherein the at least one post pin is a single structure. 19.The package of claim 12, further comprising: a plurality of post pinsfixed on the surface of the board; and a plurality of land pins providedon the another surface of the board.
 20. The package of claim 19,wherein a number of the post pins is equal to a number of the land pins.